Copper; foil, backed with paper, paperboard, plastics or similar backing material, of a thickness (excluding any backing) not exceeding 0.15mm, of refined copper7410.21

Backed

Of refined copper

Of refined copper

Of refined copper

Sheet or plate of polytetrafluoroethylene, containing aluminium oxide or titanium dioxide as filler or reinforced with glass-fibre fabric, covered on both sides with copper foil

Foils, rolls composed of one layer of glass epoxy of 100|µm colaminated with refined copper foil on one or two sides of 35|µm with a tolerance of 10|% for use in the production of smart cards

Film of polyimide, whether or not containing epoxide resin and/or glass fibre, covered on one side or on both sides with a copper foil

Sheet or plates: -|consisting of at least a central layer of paper or one central sheet of any type of nonwoven fibre, laminated on each side with glass-fibre fabric and impregnated with epoxide resin, or -|consisting of multiple layers of paper, impregnated with phenolic resin, coated on one or both sides with a copper film with a maximum thickness of 0,15|mm

Plates: -consisting of at least one layer of fibreglass fabric impregnated with thermosetting resin, -covered on one or both sides with copper foil with a thickness of not more than 0,15 mm, and -with a dielectric constant (DK) of less than 3,9 and a loss factor (Df) of less than 0,015 at a measuring frequency of 10 GHz, as measured according to IPC-TM-650

Plates: -|consisting of at least one layer of fibreglass fabric impregnated with epoxide resin, -|covered on one or both sides with copper foilwith a thickness of not more than 0,15mm and -|with a dielectric constant (DK) of less than 3,9|and a loss factor (Df) of less than 0,015|at a measuring frequency of 10GHz, as measured according to IPC-TM-650

Plates: - consisting of at least one layer of fibreglass fabric impregnated with epoxide resin, - covered on one or both sides with copper foil with a thickness of not more than 0,15 mm, - with a dielectric constant (DK) of less than 5,4 at 1 MHz, as measured according to IPC-TM-650 2.5.5.2, - with a loss tangent of less than 0,035 at 1 MHz, as measured according to IPC-TM-650 2.5.5.2, - with a comparative tracking index (CTI) of 600 or more

Plates, rolls and sheets of synthetic or artificial resin: -|with a maximum thickness of not more than 25µm, -|coated on both sides with a copper film with a maximum thickness of 0,15|mm, -|with a minimum capacitance of 1,09pF/mm$2, for use in the manufacture of circuit boards

Plates or sheets: -|with at least one layer of woven glass fibre, impregnated with a fire- retardant artificial or synthetic resin with a glass transition temperature (Tg) of more than 130|°C as measured according to IPC-TM-650, method 2.4.25, -|coated on one or both sides with a copper film with a thickness of not more than 3,2|mm, and containing at least one of the following: -|poly(tetrafluoroethylene) (CAS|RN|9002-84-0) -|poly(oxy-(2,6-dimethyl)-1,4-phenylene) (CAS|RN|25134-01-4) -|epoxy resin having a thermal expansion of not more than 10|ppm in length and width and not more than 25|ppm in height for use in the manufacture of circuit boards

Plates, rolls|or sheets: -|with at least one layer of woven glass fibre, impregnated with a fire-retardant artificial or synthetic resin with a glass transition temperature (Tg) of more than 170|°C (according to IPC-TM-650, method 2.4.25), -|coated on one or both sides with a copper film with a thickness of not more than 0,15|mm, for use in the manufacture of circuit boards

Plates, rolls|or sheets: -|with at least one layer of woven glass fibre, impregnated with a fire-retardant artificial or synthetic resin with a glass transition temperature (Tg) of more than 130|°C (according to IPC-TM-650, method 2.4.25), -|coated on one or both sides with a copper film with a thickness of not more than 3,2|mm, for use in the manufacture of circuit boards

Other